Infineon and Qualcomm Jointly Create High-quality Standard Solutions for 3D Certification

[Munich, Germany, March 6, 2020] Infineon Technology Co., Ltd. (FSE: IFX / otcqx: ifnny) cooperates with Qualcomm to develop a new technology based on Qualcomm ® snapdragon ™ The 3D certification reference design of 865 mobile platform further expands the application scope of Infineon 3D sensor technology in mobile terminals. This reference design uses real3tm 3D time of flight (TOF) sensors to support smartphone manufacturers to achieve cost-effective and easy to design standardized integration. In the past four years, Infineon has been active in the mobile terminal market with its 3D TOF sensor technology. Moreover, Infineon made a wonderful debut with the world's smallest (4.4 mm x 5.1 mm) and most powerful VGA resolution 3D image sensor at the 2020 Las Vegas International Consumer Electronics Exhibition (CES). It meets the highest standards for excellent face recognition, identity authentication, enhanced photo features and a real augmented reality experience.

Andreas urschitz, President of Infineon power management and diversified market division, pointed out: "Today, smart phones are more than just an information medium. They are increasingly taking on security and entertainment functions. 3D sensors can support new uses and more applications, such as secure identity authentication or payment through face recognition. We have been working hard in this market and set clear growth goals. We have worked with Qualcomm to develop real 3 image sensor based products The reference design highlights our potential and ambition in this field. "Infineon has developed 3D TOF sensor technology in cooperation with pmdtechnologies, which focuses on software and 3D time of flight system.

5g smart phones realize new 3D applications

Starting from March 2020, Infineon's real3 TOF sensor will realize the video bokeh function on 5g smart phones for the first time, showing the best image effect even in dynamic images. This application processes the received 3D image data with the help of accurate 3D point cloud algorithms and software. The 3D image sensor captures 940 nm infrared light reflected from users and scanned objects. It also uses advanced technology Data processing to achieve accurate depth measurement. From strong sunlight to dark indoor, the patented "background illumination suppression" (SBI) technology can provide a wide dynamic measurement range under any lighting conditions. This ensures maximum robustness without reducing the quality of data processing.